● PVDF systems: tolerate 121°C SIP; prolonged strong alkali (pH > 12) can swell. Use FFKM seals (to 150°C, superior chemical resistance to EPDM).
● PES/PSf systems: sensitive to oxidizing cleaners (e.g., NaOCl); keep free chlorine ≤ 50 ppm during CIP. Use PTFE-encapsulated fluoroelastomer; up to 2000 CIP/SIP cycles.
● PAN systems: poor high-temperature tolerance; SIP ≤ 80°C to avoid thermal degradation. Silicone rubber acceptable (to 120°C); periodically check compression set (≤ 25%).
● PA systems: good acid/base resistance; prolonged organic solvents (e.g., DMF) cause swelling. Prefer HNBR seals for better solvent resistance than NBR.
● Typical polymer/solvent references:
● PVDF: NMP, DMAc, DMF; 316L/2205 SS, Hastelloy compatible; elastomers FFKM/PEEK; PTFE-filled optional.
● PES/PSf: DMSO, NMP, DMAc; sensitive to Cu/Zn—avoid brass; seals FFKM or PEEK lip rings.
● PAN: DMF/DMSO; DMF degrades FKM—use FFKM/PTFE/PEEK.
● PA (melt/solution): amide polymers are water-sensitive; assess hydrolysis under hot steam SIP; seals PTFE + graphite fill or FFKM.
● Cleaning media and SIP:
● Caustic: NaOH 0.5–2 wt% at ≤ 60–80°C; beware Al/Zn corrosion. Oxidizers (hypochlorite/peroxy) used cautiously with PES/PSf.
● Solvent cleaning: tiered from mild to strong; control swelling risk; define material load curves (time × temp × concentration).
● SIP: 121–134°C steam, 15–45 min; suitable for PEEK bushings and PTFE seals; FKM has poor steam life, FFKM preferred.
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